Company
Adoc Talent Management is looking for a Board level multi-physical system engineer (M/F), for a leading global ICT company specializing in Cloud and AI, telecommunications, consumer, and mobile businesses. The company is a well-known multinational corporation, and its research center in Grenoble is responsible for advanced technology research and development of ICT products.
Missions
As a Board level multi-physical system engineer (M/F), you will work with an enthusiastic hardware engineering team to solve technical challenges in board level engineering.
You will be located at the expanding Grenoble Institute, where you will be tasked with developing next-generation hardware solutions at the board level. This includes multi-physics modeling and simulation for complex module reliability, simulation modeling for cable management technology, and in-situ nondestructive testing technology.
Your main Responsibilities will include :
- Explore new technologies such as electromagnetic, thermo-mechanical and physicochemical field simulation modeling of complex modules especially around their interfaces (such as BLT/TIM or underfill) with in-situ non-destructive technologies.
- Provide technical insights on next technology trends and implement them in the company’s hardware products.
- Collaborate with the local and Chinese team to solved next challenges and participate in preparing specification and design documents
You will initiate projects with external partners and/or contribute to conferences, etc.
The position offers a wide range of tasks and promising career prospects for candidates with a strong network in the field and specialized technical expertise. It is available immediately as a permanent position (CDI) in Grenoble.
Profile
You hold a Master's degree or higher, or a PhD in Electronics, microelectronics or equivalent. You have a deep understanding of microelectronics packaging, module substrate process, and module process, and be able to independently complete multi-physical field and multi-scale simulation and modeling of complex module packaging.
Also, you have multi-scale and multi-physical field simulation modeling capabilities in electricity, magnetism, heat transfer, and mechanical. You are able to understand packaging challenges for reliability such as warpage and stress management, thermo-migration, electro-migration and heat dissipation.
You have good knowledge in material properties of the constitutive layer such as PCB, TIM, substrate, underfill… and their implication on the overall integration.
You have a good experience with industrial simulation software such as COMSOL or HFSS and so on. An experience in Python coding is a plus. Finally, the ability to work in group and individually is required, and ability to work in a diversified team.
You are passionate about technology, driven by curiosity, and motivated to make substantial contributions in your area of expertise. You are fluent in English with excellent intercultural social and communication skills, and you excel in working within international teams.If you are interested, please send your application to Adoc Talent Management as soon as possible (www.adoc-tm.com)